TSV Via-last integration available for prototyping at AMF!

AMF recently showcased a fully integrated Silicon Photonics platform co-integrated with Through Silicon Via (TSV).  The primary goal of this advanced capability is to introduce additional packaging functionality onto the Silicon wafer before it undergoes the Outsourced Assembly and Test (OSAT) process. The impressive demonstration involves the seamless integration of several crucial processes, including:

· Full Front end of the line (FEOL) process

· Al-based BEOL with 4 metal layers

· Backside TSV-VL process

· Cu-pillar bump process

We are excited to collaborate with you and integrate this feature seamlessly into your upcoming prototyping run.

Contact us for more information